Thermal Science and Engineering


2578-1782 (Online)

Journal Abbreviation:

Therm. Sci. Eng.

Thermal Science and Engineering (TSE) is an international open access journal that publishes original, high-quality research articles that span activities ranging from fundamental thermodynamic scientific research to the applied discussion of maximising thermodynamic efficiencies and minimising all heat losses. Topics cover thermal biology, nanotechnology, thermal energy transport, thermodynamics, thermal medical systems, and devices, etc.

Interests include related to all areas of thermal science and engineering, but are not limited to:

  1. Energy systems, efficiency, and sustainability
  2. Manufacturing of micro and macro devices
  3. Solar system
  4. Refrigeration system
  5. Combustion system
  6. Petrochemical processing
  7. Thermal transfer processes in the traditional fields
  8. Thermal biological and medical system
  9. New understanding of heat, air, moisture transfer, etc.


Online Submissions

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Submission Preparation Checklist

As part of the submission process, authors are required to check off their submission's compliance with all of the following items, and submissions may be returned to authors that do not adhere to these guidelines.

  1. The submission has not been previously published, nor is it under the consideration of another journal (or an explanation has been provided in Comments to the Editor).
  2. The submission file is in Microsoft Word format.
  3. Where available, URLs for the references have been provided.
  4. The text adheres to the stylistic and bibliographic requirements outlined in the Author Guidelines, which is found in About the Journal.
  5. If submitting to a peer-reviewed section of the journal, the instructions in Ensuring a Blind Review have been followed.

Privacy Statement

The names and email addresses entered in this journal site will be used exclusively for the stated purposes of this journal and will not be made available for any other purpose or to any other party.

Article Processing Charges (APCs)

Thermal Science and Engineering is an Open Access Journal under EnPress Publisher. All articles published in Thermal Science and Engineering are accessible electronically from the journal website without commencing any kind of payment. In order to ensure contents are freely available and maintain publishing quality, Article Process Charges (APCs) are applicable to all authors who wish to submit their articles to the journal to cover the cost incurred in processing the manuscripts. Such cost will cover the peer-review, copyediting, typesetting, publishing, content depositing and archiving processes. Those charges are applicable only to authors who have their manuscript successfully accepted after peer-review.

Journal TitleAPCs
Thermal Science and Engineering$1000

We encourage authors to publish their papers with us and don’t wish the cost of article processing fees to be a barrier especially to authors from the low and lower middle income countries/regions. A range of discounts or waivers are offered to authors who are unable to pay our article processing charges. Authors can write in to apply for a waiver and requests will be considered on a case-by-case basis.

Vol 6, No 2 (in Publishing)

Table of Contents

Original Research Article

Fangtian Sun , Xiaoqing Zhao , Wanqing Xu , Zhicheng Wang , Yonghua Xie
VIEWS - 268 (Abstract)

View: Abstract | PDF

Original Research Article

Zhipeng Yao , Yujiao Shang , Yuping Shang
VIEWS - 169 (Abstract)

View: Abstract | PDF

Original Research Article

Abu Rayhan , Mahmidul Hasan Bhuiyan , Sk. A. Shezan , Fatin Ishraque , Altab Hossain , Siam Iqbal , Mehedi Hasan , Sharmin Akter Asha
VIEWS - 189 (Abstract)

View: Abstract | PDF

Original Research Article

Antonio Campo
VIEWS - 160 (Abstract)

View: Abstract | PDF

Original Research Article

Aidin Shaghaghi , Reza Omidifar , Rahim Zahedi , Ali Asghar Pourezzat , Mansour Keshavarzzadeh
VIEWS - 167 (Abstract)

View: Abstract | PDF

Original Research Article

Ziad Khan , Rashid Jan , Muhammad Jawad , Fawad Hussain
VIEWS - 178 (Abstract)

View: Abstract | PDF

Original Research Article

Ho Jong Kim , Rakish Shrestha , Samman Singh Pradhan , Prithvi Gurung , Prabesh Bhattarai , Nirjal Lamichhane , Cheol Sang Kim , Ranjit Shrestha
VIEWS - 411 (Abstract)

View: Abstract | PDF

Original Research Article

Vetlugin Beybalayev , Abutrab Aliverdiev
VIEWS - 103 (Abstract)

View: Abstract | PDF

Original Research Article

Shreedevi Kalyan , Jumanne Mng’ang’a
VIEWS - 46 (Abstract)

View: Abstract | PDF

Review Article

Khawla Sleiman , Stefan Van Vaerenbergh , Tayssir Hamieh
VIEWS - 177 (Abstract)

View: Abstract | PDF



New Author Guidelines are updated 

Please follow the journal's author guideline and the required article template to prepare your manuscript.

Posted: 2023-07-06 More...

【Congratulations】2023 Volume 6, Issue 1 is now available online-Latest Published Articles Read

We are pleased to announce that 2023 Volume 6, Issue 1 is published online, please click here for more details.

Posted: 2023-08-07

Prof. Sivasankaran Sivanandam Appointed As Co Editor-in-Chief Of Thermal Science And Engineering

We are pleased to announce that Prof. Sivasankaran Sivanandam has been appointed Co Editor-in-Chief of Thermal Science and Engineering (eISSN: 2578-1782).

Prof. Sivanandam received M.Sc., M.Phil., and Ph.D. degrees in 2000, 2002, 2006 respectively. After that he received the Post-Doctoral Fellowships four times in 2006, 2007, 2008 and 2011 respectively. His areas of interest are Fluid Dynamics, CFD, Convective Heat and Mass Transfer, Nanofluids, Porous Media, and Microchannel Heat Sinks. He is a member of editorial board in several international journals.

The TSE editorial team warmly welcomes Prof. xx as the Co Editor-in-Chief and looks forward to his contribution to the continued success of Thermal Science and Engineering. For further information on the journal Editorial Board, please check here.

Prof. Sivasankaran Sivanandam

King Abdulaziz University, Saudi Arabia

Interests: Computational Fluid Dynamics; Heat Transfer; Fluid Flow; Nanofluids

Posted: 2023-05-22
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