Numerical simulation and experimental study of contact thermal resistance under high temperature conditions

Linquan Shi, Qiang Li

Article ID: 1523
Vol 5, Issue 1, 2022

VIEWS - 499 (Abstract) 281 (pdf)

Abstract


Contact thermal resistance is an important indicator of the efficiency of heat transfer between contact interfaces.The contact thermal resistance between the interfaces of superalloy GH4169 in high temperature was investigated byusing ANSYS. The real surface morphology of superalloy was obtained with optical microscope, and its surface modelwas reconstructed in ANSYS. Based on the theory of structural mechanics, the elastoplastic deformation of the microstructure of the contact interface is simulated, and analyzed and obtained the contact thermal resistance between contactinterfaces. The effect of interface temperature on the radiative heat transfer between the contact interfaces was studied.At the same time, the impact of radiation heat transfer between contact interfaces in high temperature is considered.Finally, it was tested by using an experimental test device. The result show that the maximum deviation between thecontact thermal resistance and the contact thermal resistance was 12.60%, and the contact thermal resistance betweensuperalloy interfaces decreases with the increase of interface temperature and contact pressure; the contact interfacetemperature difference increases first and then decreases with the increase of interface temperature.

Keywords


High Temperature; Contact Thermal Resistance; Numerical Simulation; High Temperature Alloys

Full Text:

pdf


References


1. Wang A, Zhao J. Review of prediction for thermal contact resistance. Science China Technological Sciences 2010; 53: 1798–1808.

2. Zhang P, Xuan Y, Li Q. Development on thermal contact resistance. CIESC Journal 2012; 63(2): 335–349.

3. Greenwood JA. Constriction resistance and the real area of contact. British Journal of Applied Physics 2002; 17(12): 1621–1632.

4. Cooper MG, Mikic BB, Yovanovich MM. Thermal contact conductance. International Journal of Heat and Mass Transfer 1969; 12(3): 279–300.

5. Liu D, Zhang J. Numerical simulation of high-temperature thermal contact resistance and its reduction mechanism. PLOS ONE 2018; 13(3): e194483.

6. Cui T, Li Q, Xuan Y, et al. Multiscale simulation of thermal contact resistance in electronic packaging. International Journal of Thermal Sciences 2014; 83: 16–24.

7. Fang W, Gou J, Chen L, et al. A multi-block lattice Boltzmann method for the thermal contact re-sistance at the interface of two solids. applied thermal engineering 2018; 138: 122–132.

8. Gou J, Ren X, Dai Y, et al. Study of thermal contact resistance of rough surfaces based on the practical topography. Computers & Fluids 2018; 164: 2–11.

9. Dai Y, Gou J, Ren X, et al. A test-validated pre-diction model of thermal contact resistance for Ti-6Al-4V alloy. Applied Energy 2018; 228: 1601–1617.

10. Xian Y, Zhang P, Zhai S, et al. Re-estimation of thermal contact resistance considering nearfield thermal radiation effect. Applied Thermal Engi-neering 2019; 157: 113601.

11. Yang B, Li M, Gao J, et al. Temperature depend-ence study on thermophysical properties of gra-phene foam and the correlation with interface thermal conductance. Journal of Thermal Science and Technology 2019; 18(4): 259–265.

12. Zhang P, Xuan Y, Li Q. A high-precision instru-mentation of measuring thermal contact resistance using reversible heat flux. Experimental Thermal and Fluid Science 2014; 54: 204–211.

13. Xuan Y, Li Q, Zhang P. Measurement method and instrument of thermal contact resistance at high temperature. Scientia Sinica (Technologica) 2019; 49(5): 491–500.

14. China Aviation Materials Handbook Committee. Zhongguo hangkong cailiao shouce (Chinese) [China aviation materials handbook]. Beijing: China Standard Press; 2002.

15. Zhu B. Youxian danyuanfa yuanli yu yingyong (Chinese) [The finite element method theory and applications].4th ed. Beijing: China Water Power Press; 2018.

16. Yang S, Tao W. Chuanrexue (Chinese) [Heat Transfer]. 4th ed. Beijing: Higher Education Press; 2006.

17. Ling G. ANSYS 14.0 relixue fenxi cong rumen dao jingtong (Chinese) [ANSYS 14.0 thermodynamic analysis from entry to proficiency]. Beijing: Tsinghua University Press; 2013.

18. Madhusudana CV. Accuracy in thermal contact conductance experiments-the effect of heat losses to the surroundings. International Communica-tions in Heat and Mass Transfer 2000; 27(6): 877–891.

19. Carbone G, Bottiglione F. Asperity contact theo-ries: Do they predict linearity between contact area and load? Journal of the Mechanics and Physics of Solids 2008; 56(8): 2555–2572.




DOI: https://doi.org/10.24294/tse.v5i1.1523

Refbacks

  • There are currently no refbacks.


Copyright (c) 2022 Linquan Shi, Qiang Li

Creative Commons License
This work is licensed under a Creative Commons Attribution-NonCommercial 4.0 International License.

This site is licensed under a Creative Commons Attribution 4.0 International License.