Some Important Problems and Progress in Micro / Nano-scale Thermal Science and Engineering

Yuanming Zhao, Anna Qiu, Juexian Qi

Article ID: 366
Vol 1, Issue 1, 2018

VIEWS - 8021 (Abstract)

Abstract


This paper describes the significance, content, progress and corresponding basic theory and experimental research methods of micron/nanometer scale thermal science and engineering, which is one of the latest cutting-edge disciplines, and analyzes the effects of micron nanometer devices on the scale effect series of challenging hot issues, discussed the corresponding emergence of some new phenomena and new concepts, pointed out that the micron/nano thermal science aspects of the recent development of several types of theory and experimental technology success and shortcomings, and summed up a number for the exploration of the new ways and new directions, especially on some typical micron/nano-thermal devices and micro-scale biological heat transfer in some important scientific issues and their engineering applications were introduced.


Keywords


Thermal Science; MEMS; Nanotechnology; Devices; Biotechnology

Full Text:

PDF


References


Gad-el-Hak M.ASME Journal of Fluids, 1999, 121: 5 Tien CL, et al. Microscale Thermophysical Engineering, 1997, 1: 71 Tien CL, Majumdar A, Gerner FM. Microscale Energy Transport. New York: Tayloru0026Francis, 1998 Koumura N, Zi Jlstra RW J, van Delden RA et al. Nature, 1999, 401: 152 National Materials Advisory Board. Microelectromechanical Systems-advanced Materials and Fabrication Methods. Washington DC: National Academy Press, 1997 Feynman R. Journal of Microelectromechanical Systems, 1992, 1: 60 Feynman R. Journal of Microelectromechanical Systems, 1993, 2: 4 Ciofalo M, Collins MW, Hennessy TR. Med . Eng. Phys, 1996, 18: 437 Kotake S. JSME International Journal Series B: Fluids and Thermal Engineering, 1995, 38: 1. Tien CL, Armaly BF, Jagannathan PS. Proc. 8th Thermal Conductivity Conference. New York: Plenum Press, 1969. 13-19. Ziman JM. Electrons and Phonons—the Theory of Transport Phenomena in Solids. Oxford: Oxford Press, 1963 Bankoff SG. ASME J. of Heat Transfer, 1994, 116: 10 Jr. Wayner PC. In: Tien CL, Majumdar A, Gerner FM eds. Microscale Energy Transport. New York: Taylor Francis, 1998. 187-227 Goodson KE, Ju YS, Asheghi M. In: Tien CL, Majumdar A, Gerner FM eds. Microscale Energy Transport. New York: Taylor Francis, 1998. 229-294 Ho CM, Tai Y C. ASME J. Fluids Engineering, 1996, 118: 437 Gravesen P, Branebjerg J, Jensen OS. J. Micromech. Microeng., 1993, 3: 168 Elwenspoek M, Lammerink TS, Miyake R, et al. J. Micromech. Microeng., 1994, 4: 227 Shoji S, Esashi M. J. Micromech. Microeng, 1994, 4: 157 Duncan AB, Peterson GP. Appl. Mech. Rev., 1994, 47: 397 Tien CL, Chen G. ASME J. of Heat Transfer, 1994, 116: 799 Flik MI, Tien CL. ASME J. of Heat Transfer, 1990, 112: 872 Majumdar A. ASME J. of Heat Transfer, 1993, 115: 7 Jen CP, Chieng CC. J ournal of Thermophysics and Heat Transfer, 1998, 12: 146 Majumdar A. In: Tien CL, Majumdar A, Gerner FM, eds. Microscale Energy Transport. New York: Taylor Francis, 1998. 3-94 Chen G, Tien CL. Journal of Thermophysics and Heat Transfer, 1993, 7: 311 Schwab K, Henriksen EA, Worlock JM et al. Nature, 2000, 404: 974 Cho A. Science, 2000, 288: 591 Nakayama W. In: Tien CL, ed. Annual Review of Heat Transfer, 1997. 8: 1 Weisberg A, Bau HH, Zemel JN. Int. J. Heat Mass Transfer, 1992, 35: 2465 Peterson GP , Swanson LW, Gerner FM. In: Tien CL, Majumdar A, Gerner FM, eds. Microscale Energy Transport. New York: Taylor Francis, 1998. 295-338 Waitz IA, Gauba G, Tzeng YS. ASME J. of Fluid Engineering, 1998, 120: 109 Lin L, Pisano AP, Lee AP. 6th International Conference on Solid State Sensors and Actuators, Digest of Technical Papers. San Francisco, 1991. 1041 Bergstrom PL, Ji J, Liu YN, et al. Journal of Microelect romechanical Systems, 1995, 4: 10 Kataoka DE, Troian SM. Nature, 1999, 402: 794 Rubinsky B. In: Tien CL, Majumdar A, Gerner FM eds. Microscale Energy Transport. New York: Taylor Francis, 1998. 339—368 Miaoulis IN, Tada H, Mann S, et al. Advances in Heat and Mass Transfer in Biotechnology, ASME, 1997, HTD-Vol. 355 BED-Vol. 37: 33 Christel LA, Petersen K, McMillan W, et al. ASME Journal of Biomechanical Engineering, 1999, 121: 22 Flik M, Choi BI, Goodson KE. ASME J. of Heat Transfer, 1992, 114: 666 Mirmira SR, Fletcher LS. Journal of Thermophysics and Heat Transfer, 1998, 12: 121 Volklein F, Kessler E. Thin Solid Films, 1986, 142: 169 Guehther AH, McIver HK. Thin Solid Films, 1988, 163: 203



DOI: https://doi.org/10.24294/tse.v1i1.366

Refbacks

  • There are currently no refbacks.


Copyright (c) 2018 Yuanming Zhao, Anna Qiu, Juexian Qi

License URL: http://creativecommons.org/licenses/by-nc/4.0/

This site is licensed under a Creative Commons Attribution 4.0 International License.